Inkjet printing is a rapidly growing technology for depositing functional materials in the production of organic electronics. Challenges lie among others in the printing of high resolution patterns with high aspect ratio of functional materials to obtain the needed functionality like e.g. conductivity. μPlasma printing is a technology which combines atmospheric plasma treatment with the versatility of digital on demand printing technology to selectively change the wetting behaviour of materials. In earlier research it was shown that with μPlasma printing it is possible to selectively improve the wetting behaviour of functional inks on polymer substrates using atmospheric air plasma. In this investigation we show it is possible to selectively change the substrate wetting behaviour using combinations of different plasmas and patterned printing. For air and nitrogen plasmas, increased wetting of printed materials could be achieved on both polycarbonate and glass substrates. A minimal track width of 320 μm for a 200 μm wide plasma needle was achieved. A combination of N2 with HMDSO plasma increases the contact angle for water up from <100 to 1050 and from 320 to 460 for DEGDMA making the substrate more hydrophobic. Furthermore using N2-plasma in combination with a N2/HMDSO plasma, hydrophobic tracks could be printed with similar minimal track width. Combining both N2 -plasma and N2/HMDSO plasma treatments show promising results to further decrease the track width to even smaller values.
In this article we investigate the change in wetting behavior of inkjet printed materials on either hydrophilic or hydrophobic plasma treated patterns, to determine the minimum obtainable track width using selective patterned μPlasma printing. For Hexamethyl-Disiloxane (HMDSO)/N2 plasma, a decrease in surface energy of approx. 44 mN/m was measured. This resulted in a change in contact angle for water from <10 up to 105 degrees, and from 32 up to 46 degrees for Diethyleneglycol-Dimethaclylate (DEGDMA). For both the nitrogen, air and HMDSO/N2 plasma single pixel wide track widths of approx. 320 μm were measured at a plasma print height of 50 μm. Combining hydrophilic pretreatment of the glass substrate, by UV/Ozone or air μPlasma printing, with hydrophobic HMDSO/N2 plasma, the smallest hydrophilic area found was in the order of 300 μm as well.
In manufacturing of organic electronics, inkjet printing as an alternative technique for depositing materials is becoming increasingly important. Aside to the ink formulations challenges, improving the resolution of the printed patterns is a major goal. In this study we will discuss a newly developed technique to selectively modify the substrate surface energy using plasma treatment as a means to achieve this goal. First, we look at the effects of the μPlasma treatment on the surface energy for a selection of plastic films. Second, we investigated the effects of the μPlasma treatment on the wetting behaviour of inkjet printed droplets to determine the resolution of the μPlasma printing technique. We found that the surface energy for all tested films increased significantly reaching a maximum after 3-5 repetitions. Subsequently the surface energy decreased in the following 8-10 days after treatment, finally stabilizing at a surface energy roughly halfway between the surface energy of the untreated film and the maximum obtained surface energy. When μPlasma printing lines, an improved wetting abillity of inkjet printed materials on the plasma treated areas was found. The minimal achieved μPlasma printed line was found to be 1 mm wide. For future application it is important to increase the resolution of the plasma print process. This is crucial for combining plasma treatment with inkjet print technology as a means to obtain higher print resolutions.
